Synthetic Cordierite
l Features
Low temperature glass frit powder usually has high thermal expansion, lead titanate which has negative thermal expansion is widely used to blend with low temperature glass frit to adjust its thermal expansion for ceramic substrate (PCB).
Duo to environmental issue, PbO is gradually no longer used.
Our synthetic cordierite SS-200 has low thermal expansion with 200mesh particle size, can be used as an ideal substitution of lead titanate.
l Application
Glass sealant for electronic materials and VFD.
l Specification
|
Item |
Unit |
Synthetic Cordierite SS-200 |
|
SiO2 |
% (references) |
49.89 |
|
Al2O3 |
36.07 |
|
|
Fe2O3 |
0.12 |
|
|
TiO2 |
0.09 |
|
|
CaO |
0.16 |
|
|
MgO |
13.11 |
|
|
K2O |
0.23 |
|
|
Na2O |
0.13 |
|
|
Ig. Loss |
0.20 |
|
|
Average Particle Size |
µm |
7 |
|
Sintering Temperature |
°C |
1450 |
|
Color |
|
White |
|
Bulk Specific Gravity |
g/cc |
2.6 |
|
Apparent Porosity |
% |
0 |
|
Water Absorption |
% |
0 |
|
Bending Strength |
MPa |
150 |
|
Compressible Strength |
GPa |
- |
|
Fracture Toughness |
MPam1/2 |
1～1.5 |
|
Thermal Expansion Coefficient |
x 10-6 (700°C) |
1.7 |
|
Thermal Conductivity |
w/m．k |
4 |
|
Specific Heat |
J/(g．k) |
0.71 |
|
Thermal Shock Resistance |
°C |
400 |
|
Volume Resistivity |
Ω．Cm |
>1014 |
|
Permittivity |
1MHZ |
4.9 |
|
Dissipation Factor |
1MHZ |
9x10-4 |
|
Te Value |
°C |
- |
|
Breakdown Voltage |
KV/mm |
19.1 |
*The above values are typical data and shall not be regarded as guaranteed specification.
