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l   Features

Low temperature glass frit powder usually has high thermal expansion, lead titanate which has negative thermal expansion is widely used to blend with low temperature glass frit to adjust its thermal expansion for ceramic substrate (PCB).

Duo to environmental issue, PbO is gradually no longer used.

Our synthetic cordierite SS-200 has low thermal expansion with 200mesh particle size, can be used as an ideal substitution of lead titanate.


l   Application

Glass sealant for electronic materials and VFD.


l   Specification

Item

Unit

Synthetic Cordierite SS-200

SiO2

%

(references)

49.89

Al2O3

36.07

Fe2O3

0.12

TiO2

0.09

CaO

0.16

MgO

13.11

K2O

0.23

Na2O

0.13

Ig. Loss

0.20

Average Particle Size

µm

7

Sintering Temperature

°C

1450

Color

White

Bulk Specific Gravity

g/cc

2.6

Apparent Porosity

%

0

Water Absorption

%

0

Bending Strength

MPa

150

Compressible Strength

GPa

-

Fracture Toughness

MPam1/2

11.5

Thermal Expansion Coefficient

x 10-6 (700°C)

1.7

Thermal Conductivity

w/mk

4

Specific Heat

J/(gk)

0.71

Thermal Shock Resistance

°C

400

Volume Resistivity

ΩCm

>1014

Permittivity

1MHZ

4.9

Dissipation Factor

1MHZ

9x10-4

Te Value

°C

-

Breakdown Voltage

KV/mm

19.1


*The above values are typical data and shall not be regarded as guaranteed specification.